June 15, 2026
From June 12 to 14, the Changchun International Optoelectronic Expo (CCIOE 2026) was held at the Changchun Northeast Asia International Expo Center. The expo focused on six core industries — semiconductors and high-end manufacturing, satellite technology and low-altitude economy, optoelectronic materials and displays, optoelectronic sensing and instruments, laser technology and applications, and automotive electronics — gathering numerous industry experts and upstream/downstream enterprises.
Triple-Stone (Booth A2-D15) presented its 512×512 OCS, 8-channel arrayed circulator and small-pitch fiber array unit, along with application solutions, showcasing its latest technological breakthroughs.

Based on MEMS optical switching technology, the 512×512 all-optical switch is a large-scale non-blocking switching device supporting 512 peer fiber ports, meeting the massive data-switching needs of ultra-large data-center aggregation layers and AI computing clusters. After topology configuration, it achieves nanosecond-level ultra-low latency, transparent rate and wavelength, and zero crosstalk between ports during switching. Integrated with US Conec ELiMENT® MDC connectors, it greatly increases fiber capacity per unit space while maintaining low insertion loss.

The 8-channel arrayed circulator integrates eight circulator units into a single package measuring just 82 × 45 × 11.5 mm, optimized for space-constrained optical modules and equipment to enable high-density deployment. Working with the Triple-Stone OCS all-optical switch, it enables high-density port optical-path scheduling and signal routing within data-center optical interconnection networks.

The MCF FIFO is a high-performance optical interconnect device based on space-division multiplexing, multiplying single-fiber channel capacity by four. Its ultra-miniature package (φ≤3.0 × L≤38 mm) reduces internal space usage and cabling complexity, with low crosstalk (<−50 dB) ensuring signal integrity and transmission reliability across parallel channels. The small-pitch fiber array unit offers 8 to 32 channels with custom quantities, standard channel pitches (82/127/250 µm) or custom spacing, enabling higher-density optical port deployment in limited equipment space.

Featuring high stability, low power consumption and high optical power handling, the MEMS VOA comes in a millimeter-scale φ2.2 mm package supporting miniaturized EDFA high-density card integration.

Triple-Stone will continue to fully support the development of the optical communications industry — from technology R&D to product delivery, empowering customers to develop efficiently with full-chain service.



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